Sputtering gun

Designed by Arrayed Materials. The angle of the target can be adjusted in situ by software.

The shield is higher than the target;

Special designing avoids short circuit in sputtering gun;

The angle of the target can be adjusted in situ by software, which has better repetitiveness;

The sputtering can be focused onto wafer automatically, depending on defferent T-S distance;

Easy for cleaning and target exchange;

Compatible with DC, pulsed DC, and RF power supply.